−18°C
max junction temperature reduction
Background
[Placeholder — describe the drivetrain DC–DC converter, operating conditions, and the thermal problem that needed solving.]
Approach
[Placeholder — describe the simulation methodology: geometry setup in Icepak, mesh strategy, boundary conditions, thermal interface materials modeled, load cases simulated.]
Simulation model / geometry screenshot
Process
[Placeholder — walk through what was iterated: heatsink geometry variants, fin density, airflow path, TIM optimization. How many design points, what the sweep looked like.]
Temperature distribution plot (before / after)
Results
[Placeholder — quantify the outcome. −18°C junction temp reduction, what it meant for device reliability or derating, whether the form factor constraint was maintained.]
- [Key result 1]
- [Key result 2]
- [Key result 3]